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CXSD6285双PWM降压控制器和一个内部线性调节器用于DDR存储器和MCH电源解决方案两个同步PWM buck控制ler驱动四个N通道mosfet
发表时间:2020-04-22浏览次数:128
CXSD6285双PWM降压控制器和一个内部线性调节器用于DDR存储器和MCH电源解决方案两个同步PWM buck控制ler驱动四个N通道mosfet
 

目录usS嘉泰姆

1.产品概述                       2.产品特点usS嘉泰姆
3.应用范围                       4.下载产品资料PDF文档 usS嘉泰姆
5.产品封装图                     6.电路原理图                   usS嘉泰姆
7.功能概述                        8.相关产品usS嘉泰姆

一,产品概述(General Description)    usS嘉泰姆


      The CXSD6285 integrates Dual PWM buck controllers and an internal linear regulator for DDR memory and MCH power solution. The two synchronous PWM buck control-lers drive four N-channel MOSFETs for DDR memory sup-ply voltage (VDDQ) and MCH regulator. The internal regu-lator is designed to track at the half of the reference volt-age with sourcing and sinking current for DDR memory termination regulator (VTT).usS嘉泰姆
        The CXSD6285 uses the latched BUF_Cut signal and the POR of the BOOT to comply with ACPI power sequencing specifications. The two PWM regulators also provide POKsignals to indicate that the regulators are good. The de-vice also has the phase shift function between the two PWM controllers. The protection functions of the two PWM controllers include over-current protection, under-voltage protection, and external soft-start function. The VTT regu-lator provides 2A sinking and sourcing current-limit func-tion and also has thermal shutdown protection.usS嘉泰姆
        The TSSOP-24P package with a copper pad provides excellent thermal impedance is available.usS嘉泰姆
二.产品特点(Features)usS嘉泰姆


1.)Provide Synchronous Rectified Buck PWM Controllers for VDDQ and        VMCHusS嘉泰姆
2.)Integrated Power FETs with VTT RegulatorusS嘉泰姆
       Source/Sink up to 2.0AusS嘉泰姆
3.)Drive Low Cost N-Channel Power MOSFETsusS嘉泰姆
4.)Internal 0.8V Reference Voltage for AdjustableusS嘉泰姆
      VDDQ and VMCHusS嘉泰姆
5.)Thermal ShutdownusS嘉泰姆
6.)VTT Tracks at Half the Reference VoltageusS嘉泰姆
7.)Fixed Switching Frequency of 250kHz for VDDQusS嘉泰姆
     and VMCHusS嘉泰姆
8.)Over-Current Protection and Under-VoltageusS嘉泰姆
      Protection for VDDQ and VMCHusS嘉泰姆
9.)Fully Complies with ACPI Power SequencingusS嘉泰姆
      SpecificationsusS嘉泰姆
10.)180 degrees Phase Shift between VDDQ and VMCHusS嘉泰姆
11.)Power-OK Function for VDDQ and VMCHusS嘉泰姆
12.)Fast Transient ResponseusS嘉泰姆
       Maximum Duty Cycle 90%usS嘉泰姆
       High-Bandwidth Error AmplifierusS嘉泰姆
13.)Simple Single-Loop Control DesignusS嘉泰姆
      Voltage Mode PWM ControlusS嘉泰姆
      External Compensation
14.)External Soft-Start for VDDQ and VMCHusS嘉泰姆
15.)Shutdown Function for VDDQ/VTT and VMCHusS嘉泰姆
16.)Thermally Enhanced TSSOP-24P PackageusS嘉泰姆
17.)Lead Free and Green Devices Available (RoHS Compliant)usS嘉泰姆
三,应用范围 (Applications)usS嘉泰姆


 DDR Memory and MCH Power SupplyusS嘉泰姆
四.下载产品资料PDF文档 usS嘉泰姆


需要详细的PDF规格书请扫一扫微信联系我们,还可以获得免费样品以及技术支持usS嘉泰姆

 QQ截图20160419174301.jpgusS嘉泰姆

五,产品封装图 (Package)usS嘉泰姆


usS嘉泰姆

六.电路原理图usS嘉泰姆


blob.pngusS嘉泰姆

七,功能概述usS嘉泰姆


Output Inductor SelectionusS嘉泰姆
The inductor value determines the inductor ripple current and affects the load transient response.usS嘉泰姆
Higher inductor value reduces the inductor’s ripple current and induces lower output ripple voltage.usS嘉泰姆
The ripple current and ripple voltage can be approximated by:where FS is the switching frequencyusS嘉泰姆
of the regulator.Although increases the inductor value to reduce the ripple current and voltage, thereusS嘉泰姆
is a tradeoff existing between the inductor’s ripple current and the regulator load tran-sient response time.usS嘉泰姆
A smaller inductor will give the regulator a faster load transient response at the expense of higher ripple current.usS嘉泰姆
The maximum ripple current occurs at the maximum in-put voltage. A good starting point is to chooseusS嘉泰姆
the ripple current to be approximately 30% of the maximum output current.Once the inductance valueusS嘉泰姆
has been chosen, select an inductor that is capable of carrying the required peak cur-rent without goingusS嘉泰姆
into saturation. In some types of inductors, especially core that is make of ferrite, the ripple current willusS嘉泰姆
increase abruptly when it saturates. This will result in a larger output ripple voltage.usS嘉泰姆
Output Capacitor SelectionusS嘉泰姆
Higher Capacitor value and lower ESR reduce the output ripple and the load transient drop. Therefore,usS嘉泰姆
select high performance low ESR capacitors are intended for switch-ing regulator applications.usS嘉泰姆
In some applications, mul-tiple capacitors have to be parallelled to achieve the de-sired ESR value.usS嘉泰姆
A small decoupling capacitor in parallel for bypassing the noise is also recommended, and theusS嘉泰姆
voltage rating of the output capacitors also must be considered. If tantalum capacitors are used,usS嘉泰姆
make sure they are surge tested by the manufactures. If in doubt, consult the capacitors manufacturer.usS嘉泰姆
Input Capacitor SelectionusS嘉泰姆
The input capacitor is chosen based on the voltage rat-ing and the RMS current rating. For reliableusS嘉泰姆
operation,select the capacitor voltage rating to be at least 1.3 times higher than the maximum input voltage.usS嘉泰姆
The maximum RMS current rating requirement is approximately IOUT/2,where IOUT is the load current.usS嘉泰姆
During power-up, the input capacitors have to handle large amount of surge current.usS嘉泰姆
If tantalum capacitors are used, make sure they are surge tested by the manufactures. If in doubt,usS嘉泰姆
consult the ca- pacitors manufacturer. For high frequency decoupling, a ceramic capacitor 1μF can beusS嘉泰姆
connected between the drain of upper MOSFET and the source of lower MOSFET.usS嘉泰姆
MOSFET SelectionusS嘉泰姆
The selection of the N-channel power MOSFETs are de-termined by the RDS(ON), reverse transferusS嘉泰姆
capacitance(CRSS)and maximum output current requirement. The losses in the MOSFETs have twousS嘉泰姆
components: conduction loss and transition loss. For the upper and lower MOSFET, the losses areusS嘉泰姆
approximately given by the following equations:usS嘉泰姆
MOSFET Selection (Cont.)usS嘉泰姆
PUPPER = IOUT 2(1+ TC)(RDS(ON))D + (0.5)(IOUT)(VIN)(tSW)FSusS嘉泰姆
PLOWER = IOUT 2(1+ TC)(RDS(ON))(1-D)usS嘉泰姆
where IOUT is the load currentusS嘉泰姆
TC is the temperature dependency of RDS(ON)usS嘉泰姆
FS is the switching frequencyusS嘉泰姆
tSW is the switching intervalusS嘉泰姆
D is the duty cycleusS嘉泰姆
Note that both MOSFETs have conduction losses while the upper MOSFET includes an additional transitionusS嘉泰姆
loss.The switching internal, tSW, is the function of the reverse transfer capacitance CRSS. The (1+TC) termusS嘉泰姆
is to factor in the temperature dependency of the RDS(ON) and can be extracted from the “RDS(ON) vsusS嘉泰姆
Temperature” curve of the power MOSFET.usS嘉泰姆
Layout ConsiderationusS嘉泰姆
In high power switching regulator, a correct layout is im-portant to ensure proper operation of the regulator. InusS嘉泰姆
general, interconnecting impedances should be mini-mized by using short and wide printed circuit traces. Sig-usS嘉泰姆
nal and power grounds are to be kept separating and finally combined to use ground plane construction orusS嘉泰姆
single point grounding. Figure 14 illustrates the layout,with bold lines indicating high current paths; these tracesusS嘉泰姆
must be short and wide. Components along the boldlines should be placed close together.usS嘉泰姆
Below is a checklist for your layout:usS嘉泰姆
·-The metal plate of the bottom of the packages (TSSOP-24P) must be soldered to the PCB and con-nect tousS嘉泰姆
the GND plane on the backside through sev-eral thermal vias. More vias is better for heatsink.usS嘉泰姆
·-Keep the switching nodes (UGATE, LGATE, and PHASE) away from sensitive small signal nodesusS嘉泰姆
since these nodes are fast moving signals. Therefore,keep traces to these nodes as short as possible.usS嘉泰姆
· Connet the FB and VTTFB to point of load and the REFSEN should be connected to the point of load ofusS嘉泰姆
the VDDQ output.usS嘉泰姆
· The traces from the gate drivers to the MOSFETs (UG1,LG1, UG2, and LG2) should be short and wide.usS嘉泰姆
Decoupling capacitor, compensation component, the resistor dividers, boot capacitors, and SS capacitorsusS嘉泰姆
should be close to their pins.usS嘉泰姆
The input capacitor should be near the drain of the upper MOSFET; the output capacitor should be nearusS嘉泰姆
the loads.usS嘉泰姆
The input capacitor GND should be close to the out-put capacitor GND and the lower MOSFET GND.usS嘉泰姆
The drain of the MOSFETs (VIN and phase nodes)usS嘉泰姆
should be a large plane for heat sinking.usS嘉泰姆

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